发明名称 |
Multi-chip land grid array carrier |
摘要 |
A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto. |
申请公布号 |
US6097611(A) |
申请公布日期 |
2000.08.01 |
申请号 |
US19990398669 |
申请日期 |
1999.09.17 |
申请人 |
INTEL CORPORATION |
发明人 |
SAMARAS, WILLIAM A.;PHILLIPS, PAUL T.;BROWNELL, MICHAEL P. |
分类号 |
H01L23/498;H01L25/16;H05K1/02;H05K1/14;H05K3/34;H05K3/36;(IPC1-7):H05K1/18 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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