发明名称 LEADFRAME MANUFACTURING APPARATUS BY USING LASER AND THEREOF
摘要 <p>PURPOSE: An apparatus for fabricating a lead frame using a laser and a method for fabricating the lead frame using thereof are provided to reduce development time and costs of the lead frame, and to enable to process a delicate pattern, and to reduce a mechanical defect generated in a punch or a die, and to suppress a chemical defect like a contamination due to a chemical solution generated during an etching. CONSTITUTION: A laser irradiation path tube(102) through which a laser excited by a laser generation apparatus is transferred is under the laser generation apparatus. And, a laser mask(104) is located between the laser generation apparatus and a lead frame transfer apparatus(106), and a laser absorption apparatus(110) absorbing the laser generated from the laser generation apparatus is located under the lead frame transfer apparatus, as supporting the lead frame transfer apparatus. An expander(112) enables to irradiate a laser beam uniformly downward from the laser irradiation path tube. The lead frame transfer apparatus transfers a lead frame by one pitch whenever one lead frame strip enters so that it can be processed by the laser beam. A controller(95) performs the whole control of the lead frame fabrication apparatus such as an irradiation sequence of the laser beam, the intensity of the laser beam and the position of the lead frame member transferred from the lead frame transfer apparatus.</p>
申请公布号 KR100263326(B1) 申请公布日期 2000.08.01
申请号 KR19980010151 申请日期 1998.03.24
申请人 SAMSUNG TECHWIN CO.,LTD. 发明人 HAN SEONG YOUNG
分类号 B23K37/00;B23K26/00;B23K26/06;H01L23/00;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 主分类号 B23K37/00
代理机构 代理人
主权项
地址