发明名称 |
Method for soldering integrated circuits |
摘要 |
Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding block storing portion and cooled. It is then determined whether any other PCB to be soldered exists in the PCB array. If it is determined that any other PCB to be soldered exists in the PCB array, another holding block is picked up from the holding block storing portion and moved to cover an IC on the PCB of the PCB array. The above steps are repeated until all the PCBs of the PCB array to be soldered are completely soldered. If it is determined that any other PCB to be soldered does not exist in the PCB array, the PCB array is transferred to a subsequent process.
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申请公布号 |
US6095405(A) |
申请公布日期 |
2000.08.01 |
申请号 |
US19980127630 |
申请日期 |
1998.08.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, CHOUL-SU;KIM, WOO-SIK;WOO, BYUNG-WOO;TSUKUE, MASAHARU |
分类号 |
B23K1/005;H05K3/00;H05K3/34;(IPC1-7):B23K31/02;B23K35/00 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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