| 摘要 |
A microelectronic connection component is provided with leads having a surface wettable by a bonding material such as a solder at the tips of the leads which are intended to be bonded with microelectronic devices. The leads have non-wettable surfaces bounding the wettable surfaces. During bonding, the non-wettable surfaces confine liquid bonding material such as liquid solder and prevent the liquid bonding material from spreading along the leads. |
