发明名称 |
Heat sink for direct attachment to surface mount electronic device packages |
摘要 |
A heat sink adapted to thermally couple to a surface mounted heat generating electronic device package in a manner which provides an increased thermal path between the heat sink and the electronic device package. The heat sink is typically mounted piggyback on a heat generating electronic device package which is surface mounted to a printed circuit board or other substrate. The heat sink comprises thermal legs which extend from the heat sink body and are thermally coupled to thermal leads of the heat generating electronic device package.
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申请公布号 |
US6097603(A) |
申请公布日期 |
2000.08.01 |
申请号 |
US19970955481 |
申请日期 |
1997.10.22 |
申请人 |
THERMALLOY, INCORPORATED |
发明人 |
EDWARDS, STEVEN FIELDS;CLEMENS, DONALD LYNN;KUZMIN, GARY |
分类号 |
H01L23/367;H01L23/40;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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