发明名称 |
Chemical mechanical polishing machine |
摘要 |
A CMP machine includes several polishing tables mounted on a carousel, which rotates in one direction. Each of the polishing tables includes a polishing pad. Each polishing pad can polish one wafer on its first surface. Each polishing pad also has one distributing duct used to supply slurry onto the polishing pad. An exhaust duct is included to exhaust slurry, in which the exhaust duct has a first end and a second end. The first end of the exhaust duct is coupled to slurry. A regulating valve is included to regulate slurry exhaust. An exhaust pump is included to produce a exhausting force of slurry. The exhaust pump is coupled to the second end of the exhaust duct. A regulating valve controller is included to control the regulating valve.
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申请公布号 |
US6096162(A) |
申请公布日期 |
2000.08.01 |
申请号 |
US19980205561 |
申请日期 |
1998.12.04 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
LIN, JUEN-KUEN;LAI, CHIEN-HSIN;PENG, PENG-YIH;CHANG, CHIA-JUI |
分类号 |
B24B27/00;B24B37/04;B24B57/02;(IPC1-7):C23F1/02 |
主分类号 |
B24B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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