| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection between an upper electrode and a voltage applying wire by forming a lower electrode above a substrate, forming a piezoelectric above the lower electrode and then forming an upper electrode from above the piezoelectric to the side of gentle inclination. SOLUTION: A lower electrode 22 is formed above a substrate 20 of thin ceramic plate using platinum, silver, silver/palladium alloy, nickel or copper selectively. A groove is then formed and etched above the lower electrode 22 on the side being connected with a voltage applying wire thus forming a piezoelectric 24 having the side of gentle inclination thereat. Finally, an upper electrode 26 being connected with the voltage applying wire is formed from above the piezoelectric to the side of gentle inclination. According to the arrangement, connection between the upper electrode 26 and the voltage applying wire can be enhanced and the degree of freedom can be increased in the connection of the piezoelectric 24 and the voltage applying wire. |
