DRY ETCHING APPARATUS

摘要

PURPOSE: A dry-etching device is provided to increase the yield of the dry etching process by preventing from a micro arcing and the polluted particles generated during the etching process by distributing the plasma only on the wafer. CONSTITUTION: On the lower part of the dry etching device, there is a chuck(112) on which the wafer is loaded. A metal ring(114b) is formed around the chuck to make the density of the plasma uniform. A cathode(122) is mounted on the upper part of the dry etching device to face against the chuck at a predetermined distance. A restriction ring(124) is formed to support the cathode, protruding under the cathode. A screw(126) is mounted in the restriction ring to be fixed to the upper part of the dry etching device to be at a maximal distance from the restriction ring in the scope of maintaining the holding power.