ETCHING DEVICE FOR SEMICONDUCTOR WAFER,申请号KR19970036101U-传众专利搜索

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发明名称	ETCHING DEVICE FOR SEMICONDUCTOR WAFER
摘要
申请公布号	KR200183543(Y1)	申请公布日期	2000.08.01
申请号	KR19970036101U	申请日期	1997.12.08
申请人	HYUNDAI MICRO ELECTRONICS CO.,LTD.	发明人	JANG, JUNG YUEL
分类号	H01L21/306;(IPC1-7):H01L21/306	主分类号	H01L21/306
代理机构		代理人
主权项
地址

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