| 摘要 |
The invention relates to a method and device for producing copper foil (1) which is coated on both sides with polymers (7, 15) that can be hardened by thermal energy or radiation, and which is laminated onto printed circuit boards (28). The inventive method is characterized by the following method steps. Two, preferably 50 mu m thick metal foils (2) are bonded in the edge area using a hot-melt-type adhesive. The foil assembly (5) is coated with a conductive lacquer (7) with a thickness ranging from 5 to 20 mu m and, after having been prehardened, is dipped as a cathode into an electroplating bath (9). Said foil assembly is electroplated on both sides with copper (1) having a thickness ranging from 1 to 10 mu m. In a roller coating method, a dielectric (15) is applied with a thickness ranging from 5 to 100 mu m to both sides of the copper foil (1). After the dielectric (15) has been partially prehardened, the edges of the metal foil (2) including the areas of the coatings (lacquer/copper foil/dielectric (21)) located thereon are cut away, and two three-layered foil assemblies (26) are obtained which are comprised of copper foil (1) coated with polymers (7, 15) on both sides and which are laminated onto printed circuit boards (28) using laminator rollers (30) and a short-duration hot press (31). |
