发明名称 |
Semiconductor light emitting device that prevents current flow in a portion thereof directly under an electrode wire bonding pad |
摘要 |
A semiconductor light emitting device includes an insulating substrate; and a layered structure formed on the insulating substrate, the layered structure including at least a light emitting section, a positive electrode section, and a negative electrode section. A portion of the positive electrode section and a portion of the negative electrode section overlap each other via an insulating film.
|
申请公布号 |
US6097040(A) |
申请公布日期 |
2000.08.01 |
申请号 |
US19980115756 |
申请日期 |
1998.07.15 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
MORIMOTO, TAIJI;ITO, SHIGETOSHI |
分类号 |
H01L33/32;H01L33/38;H01L33/42;H01L33/44;H01L33/62;(IPC1-7):H01L33/00 |
主分类号 |
H01L33/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|