发明名称
摘要 PROBLEM TO BE SOLVED: To surely mount a connector using a high melting point metal ball on a printed board by supporting the high melting point metal ball to be fused to the conductive pattern of the printed board by the contact part of a contact. SOLUTION: A connector 1 is formed of an insulator 10, a contact 20 to be pressed thereto, and a solder ball (high melting point metal ball) 30 supported on the three-branched contact part 24 of the contact 20. The dispersion in height of the solder ball 30 can be suppressed, compared with the case when the solder ball 30 is fused to the connecting part 24 of the contact 20, and when mounted on the printed board of the connector 1, the contact 20 can be surely connected to the conductor pattern of the printed board. Thus, the miniaturization of the connector can be realized, without any trouble.
申请公布号 JP3072064(B2) 申请公布日期 2000.07.31
申请号 JP19970070627 申请日期 1997.03.07
申请人 发明人
分类号 H01L21/60;H05K3/34;(IPC1-7):H01R12/16 主分类号 H01L21/60
代理机构 代理人
主权项
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