ALIGNMENT MARK STRUCTURE HAVING PROTECTIVE DUMMY PATTERN FOR PRODUCTION OF SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide an alignment mark structure in which an alignment mark on a wafer is not damaged or deteriorated through CMP process but definite quality of the alignment mark can be sustained visually. SOLUTION: An alignment mark structure having a protective dummy pattern for production of semiconductor is provided wherein the alignment mark on a wafer is protected such that the mark is not damaged definite quality is not deteriorated visually by chemical mechanical polishing(CMP). The alignment mark structure has a scribe line of wafer or an alignment mark 102 formed in the region of a nonconstitutional part, and a protective dummy pattern 114 for protecting it against CMP. The protective dummy pattern 114 has uniform density substantially equal to that of the constitutional part region of the wafer. Since the alignment mark structure protects the alignment mark against damage and prevents the alignment mark from being deteriorated through CMP process, definite quality of the alignment mark 102 can be sustained visually.