| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate increase in resistance of wiring due to their short-circuit failure or thinning, and eliminate insufficient insulation of inter-layer insulation films, when split patterns are put together into a whole pattern by screen- printing. SOLUTION: Two or more split patterns are produced by splitting a whole- surface arranging pattern ranging over the whole surface of an electron-source substrate and/or a face plate 7, the split patterns are screen-printed by using a screen plate, and the whole-surface arranging pattern is formed over the whole surface of the electron-source substrate and/or the face plate 7. The whole-surface arranging pattern is formed by printing the two or more split patterns with two or more layers 1, 2, 3 laminated.</p> |
