发明名称 SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a soldering device, in which a rotary part is not exposed constantly to air in a melting solder liquid level, maintenance work can be executed easily, and which is not affected by stray currents. SOLUTION: A motor 6 is arranged on the tank base 2 of a tank 1, and a pipe 5 is installed by connecting it to the surface of melting solder liquid level from the tank base 2 of the tank 1. Rotation of the motor 6 is transmitted into the pump 5 and a pump 12 in melting solder 10 by a hollow pump shaft 8 through a rotary driving shaft 7 from the upper end of the rotary driving shaft 7. The hollow pump shaft 8 is covered by a sealing cap 4 and is detached. Melting solder 10 is supplied, and the shaft is filled with it so as to shield it from air.
申请公布号 JP2000208926(A) 申请公布日期 2000.07.28
申请号 JP19990009816 申请日期 1999.01.18
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 TOBA HIDEAKI
分类号 B23K1/00;B23K1/08;B23K3/06;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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