发明名称 SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent generation of a solder oxide in a solder tank and to improve maintenance in a chamber by providing a movable and operable upper side cover at an upper side of the tank and a body frame, and arranging an inert gas jetting part for forming a low oxygen atmosphere therein at an upper side of the chamber. SOLUTION: In the soldering apparatus 1, an upper side cover 26 for constituting a chamber 6 is arranged at an upper side through a body frame 3. The cover 26 is moved at a back surface side by a movement operating mechanism 31 in association with a guide member in the case of conducting a maintenance in the chamber 6, and attachable to or detachable from the frame 3. A sealed space is formed of the cover 26, a lower side cover and the body 3 in the chamber 6. To form a low oxygen atmosphere therein, an inert gas supply pipe is provided at the cover 26 side. To make an inert gas concentration in the chamber 6 uniform, a plurality of jetting parts each for injecting gas toward downward of the chamber 6 are provided at an equal interval at the supply pipe.
申请公布号 JP2000208922(A) 申请公布日期 2000.07.28
申请号 JP19990009950 申请日期 1999.01.18
申请人 SONY CORP;KOKI:KK 发明人 TAN SUGURU;MOTOMIYA IKUJIRO;OGURO KIYOUJI;HASEGAWA KIKETSU
分类号 B23K1/00;B23K1/08;B23K31/02;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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