MANUFACTURE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To improve product yield and throughput in a method of manufacturing a semiconductor device and a semiconductor manufacturing apparatus which perform grinding with a wafer laminated onto a tape. SOLUTION: The method comprises step 30 of laminating a wafer onto an extension tape expandable by the ultraviolet irradiation, step 31 of full-dicing the wafer to form individualized semiconductor chips, step 32 of expanding the expansion tape by the ultraviolet irradiation after ending the dicing step, and step 33 of grinding the expansion tape to ground the back surface of the wafer after the tape expansion step.