发明名称 MOLD RELEASE METHOD OF OPTICAL DISK SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a mold release method of an optical disk substrate that can avoid an adverse influence due to nonuniform air blow without adding any special mechanism to a die and a molding machine to be used. SOLUTION: In a method for releasing an optical disk substrate that is formed through a filling process for filling the cavity of a die with fused resin, and a cooling process for cooling the filled resin, a mechanical mold release process for mechanically releasing the optical disk substrate where the molding has been completed from the die is optimally combined with an air blow mold release process using air blow.
申请公布号 JP2000207788(A) 申请公布日期 2000.07.28
申请号 JP19990006304 申请日期 1999.01.13
申请人 RICOH CO LTD 发明人 UEDA KEIJI
分类号 G11B7/26;B29C33/44;B29C33/46;B29C45/40;B29C45/43;(IPC1-7):G11B7/26 主分类号 G11B7/26
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