| 摘要 |
PROBLEM TO BE SOLVED: To directly package an IC at an electric contact by embedding the electric contact in a substrate part, which forms a contact type IC card, so as to provide the electric contact without using a substrate. SOLUTION: An electric contact 3 is embedded in a substrate part 1 forming the contact type IC card, and for the electric contact 3, a conductive material plating a metal mainly composed of copper with nickel or gold is used. Besides, after the substrate part 1 having an opening part is produced, the electric contact 3 is inserted to the opening part of that substrate part 1, and an IC 4 is connected to the electric contact 3 by a connecting part 5. This connection is performed by soldering or while using the bump of metal provided on the IC 4 and anisotropic conductive material and afterwards, the contact type IC card is completed by sticking a back cover 2. Thus, a mechanical strength can be improved.
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