| 摘要 |
PROBLEM TO BE SOLVED: To obtain an IC contact pin which can reduce an imperfect contact due to solder after dislocation by maintaining the contact area with an IC lead. SOLUTION: The IC contact pin is provided with IC contact pin main body 1 for coming into contact with an IC lead 11 covered with solder, and a solder removing means 2 for removing and eliminating solder which is dislocated from the IC lead 11 to the contact pin main body 1 by contact. The solder removing means 2 is equipped with a solder removing part 3 which makes the tip part abut against the dislocated solder and can slide on the surface in order to remove the solder, a solder removing stand 4 which can slide on the rear of the contact pin main body 1, and a joining part which joins at least the tip part of the solder removing part 3 to the solder removing stand 4 in such a manner that both of them face each other sandwiching the contact pin main body 1.
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