RESIST SUBSTRATE FOR X-RAY EXPOSURE, ITS PRODUCTION, PRODUCTION OF DIE USING SAME AND PRODUCTION OF MICRO- PARTS USING THE DIE

摘要

PROBLEM TO BE SOLVED: To reliably and tightly bond a resist layer to a metallic substrate layer by fixing the resist layer comprising a polymethyl methacrylate plate or sheet on the metallic substrate layer comprising a plating layer by way of a metallic middle layer. SOLUTION: This resist substrate 1 for X-ray exposure has a metallic substrate layer 2 comprising Ni, a middle layer 3 comprising Ni and a resist layer 4 comprising PMMA(polymethyl methacrylate). The, middle layer 3 is formed on the resist layer 4 by sputter vapor deposition and the metallic substrate layer 2 is formed by way of the middle layer 3 by electroplating using one of the substrate layer 2 and the middle layer 3 as an electrode. When electroplating is carried out at <=40 deg.C plating bath temperature, the warping and cracking of the metallic substrate layer 2 are inhibited even if the substrate layer 2 has a relatively large thickness and the resist substrate 1 for X-ray exposure is produced in a good yield. The adhesion of the resist layer 4 to the middle layer 3 is further improved by disposing a surface layer having fine ruggedness on the resist layer 4.