ELECTROSTATIC CHUCK HAVING ENHANCED RF POWER DISTRIBUTION

摘要

PROBLEM TO BE SOLVED: To obtain a susceptor of a semiconductor processing system for distributing RF electrodes uniformly on the region of an electrode by forming a plurality of parallel electric contacts between a plurality of points distributed on at least one RF electrode of a robust electrode having low resistance and the susceptor. SOLUTION: A via 210 is connected with an RF electrode 208 and a robust electrode 212 and the via 210 touches the RF electrode 208 at a plurality of contacts 218 distributed substantially uniformly across the region of the RF electrode 208. Each via 210 has a hole 211 in one or more ceramic layer 206 filled with a conductive material 213. Lower end part 219 of each via 210 is bonded to the robust electrode 212. The vias 210 are arranged in parallel and connected in parallel between the robust electrode 212 and the RF electrode 208. RF power is distributed uniformly onto the regions of the RF electrode 208 through these electrical parallel connections distributed uniformly.