SEMICONDUCTOR DEVICE AND PRODUCTION THEREOF

摘要

PROBLEM TO BE SOLVED: To make needles, etc., of a probe card hard to slip, and to reduce the contact resistance in comparison to the conventional cases. SOLUTION: This semiconductor device is provided with an electrode pad (first and second metal wiring layers) provided on a semiconductor substrate (silicone substrate 1) and forming the central part thereof to be lower than the peripheral edge thereof, a diffusion layer 9 provided below the electrode pad, a field oxide film 10 provided around the electrode pad, and an interlayer insulating film 2 provided around the electrode pad and having a thickness larger than the peripheral edge of the electrode pad.