| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer wiring board, which can electromagnetically cut off the distance sufficiently between a major surface side and another main surface side. SOLUTION: A multilayer wiring board 20 is comprised of a first via hole 22, which junctions a first electrode 13 and a second electrode 21 and a second via hole 22 which junctions the second electrode 21 and a third electrode 14 and an interval of the first via hole 22 and a second via hole 23 on a second wiring layer 6 is so formed as to be larger than the aperture diameters of via apertures 16 and 17. As a result, a means of cutting off of electromagnetic noise between a main surface side and another main surface side of the multilayer wiring board can be realized. |
