| 摘要 |
PROBLEM TO BE SOLVED: To fix an element package to one or both sides of a heat sink plate by forming a projection or a tongue on the opposite side of the heat sink plate with respect to the circuit board. SOLUTION: A heat sink plate 10 is inserted into a slot 25 in a tab 24, and main face plates 11 and 11a are vertically arranged on the horizontal plane of a base section 21 of a fixing plate 20. The fixing plate 20 supports a pair of tongue piece 22 formed facing each other and projecting upwards. They are arranged on an opposite flank of the tab 24, that is, opposite face of the heat sink plate 10. There is a hole on the base section 21 of the fixing plate 20, and a lead of an element package attached adjoining the main face plates 11 and 11a projects out penetrating the fixing plate 20. A leg 27 expanding in the direction opposite to that of the tab 24 is formed on the fixing plate 20. The leg 27 is inserted to the circuit board and the like with an appropriate slot, and an assembly is fixed to the circuit board. |
