| 摘要 |
PROBLEM TO BE SOLVED: To learn the humidity distribution on the surface of a semiconductor wafer in a short time by obtaining the humidity distribution on the semiconductor wafer for a temperature monitor in a thermal treatment process based on a relation between sheet resistance and a thermal treatment temperature, which is previously obtained. SOLUTION: Pressure in a load locking room 6 and pressure in a treatment container 30 are set to be almost similar. A gate valve G1 is opened and the load locking room 6 and the treatment container 30 are connected. A semiconductor wafer for a temperature monitor Wm is carried into the treatment container 30 and the gate valve G1 is closed. The prescribed thermal treatment is executed on the semiconductor wafer for a humidity monitor Wm. Then, a system moves to a measuring process and the semiconductor wafer for the temperature monitor Wm, which is thermally treated, is cooled to humidity at which it can be carried. It is carried into a cassette 10 and sheet resistance is obtained. The temperature distribution on the semiconductor wafer for humidity monitor Wm is obtained based on a relation between sheet resistance and thermal treatment humidity, which is obtained.
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