| 摘要 |
PROBLEM TO BE SOLVED: To reduce the lead time of a product and the effect of external factors by reversing a second semiconductor chip toward a first semiconductor chip and directly connecting first and second connecting pads with each other to exert desired functions by a simple design. SOLUTION: A deposited material, such as solder which can be deposited by heating at low temperature, is applied to the pads of a first semiconductor chip 10 and a second semiconductor chip 20, of which the performance has been confirmed respectively. The deposited material is coagulated into protrusions at the pads. Also a material for protrusions may be directly deposited on each pad to form a contact. Next the second semiconductor chip 20 is reversed, and the pads 12a to 12d are aligned with the pads 22a to 22d, respectively to the positions determined as extraction electrodes to mount the chips together. While this state is kept, the aligned pads are bonded with each other by crimp or heat to surely make contact.
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