| 摘要 |
PROBLEM TO BE SOLVED: To provide a package board in which mismatching in a signal line is hardly generated. SOLUTION: A field through part constituted of a first via hole 7 connecting a first distributed parameter line 3 and a second distributed parameter line and second via holes 11, 12 connecting a first ground electrode 4 and a second ground electrode 6 is set capacitive. The second distributed parameter line connected with an end surface electrode 8 is set inductive. As a result, floating capacity generated in the end surface electrode is canceled by using capacitive property of the feed-through part and the inductive property of the second distributed parameter line, mismatching in a signal line is hardly generated, and deterioration of high-frequency characteristic can be prevented.
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