| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board, wherein the occurrence of solder bridge between conductive lands is suppressed effectively, even if the array pitch between adjoining conductive lands is reduced due to higher mounting density of an electronic circuit components. SOLUTION: In a printed board 1, the lead wire of an electronic circuit component 7 is inserted into a conductive land 3b formed on the rear surface of an insulating board 2 for soldering by jet soldering, the conductive land 3b is formed into a rhombus form, while an end part 3m on the upper stream side relative to the flow of jetting solder at soldering is the vertex part of an isosceles triangle.
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