| 摘要 |
PROBLEM TO BE SOLVED: To readily and reliably resin-seal an electrode terminal forming face of a semiconductor wafer with a pole-like electrode. SOLUTION: In this resin-sealing method, a wiring pattern having one end side connected to each electrode terminal is formed via an insulation layer on an electrode terminal forming face of a semiconductor wafer 10, and the electrode terminal forming face side of the semiconductor wafer with a pole-like electrode forming a pole-like electrode 16 at another end side of each wiring pattern is resin-sealed by exposing the apex end face of each pole-like electrode 16. In this case, a paste-like resin material 30 is supplied to the electrode terminal forming face of the semiconductor wafer 10, and while the top end of a squeegee 32 rubs the apex end face of each pole-like electrode 16, the squeegee 32 is moved on the electrode terminal forming face, and a gap between the pole-like electrodes 16 is filled up with a resin material 30, and also the apex end face of each pole-like electrode 16 is exposed to resin-seal the electrode terminal forming face.
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