发明名称 FORMING METHOD OF LAMINATED FILM AND THIN FILM FORMING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a stable laminated layer made of a semiconductor thin film and an insulating film, by reducing a defect in an interface with upper and lower insulating films when a good polycrystal semiconductor thin film is formed in a low temperature process. SOLUTION: When a laminated layer made up of a semiconductor thin film 15 and a lower insulating film 14 is formed on a substrate 11, the semiconductor thin film 15 is grown in a vacuum chamber in a chemical vapor growth (catalytic CVD) by using a catalyst. The insulating film 14 is, as an example, grown in a chemical vapor growth (plasma CVD) using plasma. In this case, the insulating film 14 and the semiconductor thin film 15 are formed continuously without breaking vacuum state.
申请公布号 JP2000208422(A) 申请公布日期 2000.07.28
申请号 JP19990002387 申请日期 1999.01.08
申请人 SONY CORP 发明人 SUGANO YUKIYASU;KUNII MASABUMI;URAZONO TAKENOBU
分类号 H01L29/786;C23C16/24;C23C16/34;C23C16/40;C23C16/54;H01L21/205;H01L21/31;H01L21/316;H01L21/336;(IPC1-7):H01L21/205 主分类号 H01L29/786
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