AQUEOUS DISPERSOID FOR CHEMICAL-MECHANICAL POLISHING IN MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an aqueous dispersoid for chemical-mechanical polishing in manufacturing a semiconductor device which has an adequate hardness, provides a satisfactory polishing rate and avoids damaging a polished surface and a method of polishing films of a semiconductor device with this aqueous dispersoid and manufacturing the semiconductor device. SOLUTION: An aqueous dispersoid for chemical-mechanical polishing in manufacturing a semiconductor device is obtained which contains at least one kind of polymer grains selected among polymer grains obtained by copolymerizing a cross linking monomer such as divinylbenzene with other monomers such as styrene and polymer grains of a specified mean grain size obtained by copolymerizing these specific monomers. A semiconductor device is obtained by a manufacturing method having a step of polishing films with the aqueous dispersoid used as abrasives.