| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive composition having small sensitivity dependency on post-exposure baking temperature, excellent in uniformity of intrasurface line width of a fine pattern even on a large area substrate and excellent also in developability and adhesion by incorporating a bonding resin, a compound which is degraded by irradiation with active light or radiation to generate an acid and a specified morpholine derivative. SOLUTION: This photosensitive composition contains a bonding resin, a compound which is degraded by irradiation with active light or radiation to generate an acid and 0.001-10 wt.% morpholine derivative based on the total weight of the bonding resin. In the case of <0.001 wt.%, adhesion enhancing effect lowers remarkably. In the case of >10 wt.%, the rate of a residual film and sensitivity lower. The morpholine derivative is preferably prepared by introducing an organic group into morpholine of the formula (where R1 is H, 1-4C alkyl such as methyl, ethyl, propyl or butyl or the like). |
