| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting on a base substrate with high precision without being influenced by a melting condition of solder by melting solder under a condition where an optical semiconductor element is held with a chuck. SOLUTION: An optical semiconductor element 1 is positioned over a base substrate 3 and solder 2, and the optical semiconductor element 1 is applied as load, to an optical semiconductor element chuck 14 holding the optical semiconductor element 1, pressed against the base substrate 3 with uniform load with the solder 2 in between. Light is projected as heating light from a heating emission lens 31 provided below the base substrate 3, and transmitted through a base heating aperture 23 formed of quartz glass and a base absorption part 21, and supplied to the base substrate 3, to melt solder 2. As a result, a method for mounting onto the base substrate 3 with high precision without being influenced by a melting condition of the solder 2 is provided.
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