| 摘要 |
PROBLEM TO BE SOLVED: To constitute a module of high reliability capable of withstanding temperature cycle test. SOLUTION: A compound semiconductor element is provided with a submount 12 whose one surface is connected with one surface of a compound semiconductor chip 11, a Peltier module 13 whose one surface is connected with the other surface of the submount 2, a heat radiating plate 14 whose one surface is connected with the other surface of the Peltier module 13, a package 15 whose one surface is connected with one surface of the radiating plate 14, a cap 16 covering the aperture part of the package 15, and a window 17 formed in the cap 16. This element is provided with the submount 12 made of a material whose coefficient of linear expansion approximates that of the compound semiconductor chip 11, a board for the Peltier module 13, the radiating plate 14 composed of a material whose thermal resistance is small and coefficient of linear expansion approximates that of the compound semiconductor chip 11, and the package 15 composed of a material which has a coefficient of linear expansion approximating that of the radiating plate 14.
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