发明名称 SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To positively execute soldering by preventing a solder from being oxidized. SOLUTION: A soldering device is constituted of a solder tank 5 where melting solder 10 is stored, an upper cover 26 positioned above the solder tank 5 and above a transfer mechanism 4 for transporting a work 2 and a lower cover 27 positioned below the transfer mechanism 4 and above the solder tank 5. A chamber 6, where a low oxygen atmosphere is formed inside, a gas supply pipe 41 which is installed on an upper side in the chamber 6 in the circumferential direction, supplies an inert gas into the chamber 6 and in which a blow-off part 42 for blowing off inert gas into the chamber 6 is arranged, and a rectifying board 43 which is fitted to the gas supply pipe 41 between the transfer mechanism 4 and the blow-off part 42 in the chamber 6, holds the inert gas blown off from the blow-off part 42 above the chamber 6 in high concentration and in which an opening part 47 supplying inert gas held above the chamber 6 in a high concentration below the chamber 6 is formed are installed.
申请公布号 JP2000208921(A) 申请公布日期 2000.07.28
申请号 JP19990009949 申请日期 1999.01.18
申请人 SONY CORP 发明人 TAN SUGURU;MOTOMIYA IKUJIRO
分类号 B23K1/00;B23K1/08;B23K31/02;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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