METHOD OF SUPPLYING ABRASIVES TO WAFER POLISHER

摘要

PROBLEM TO BE SOLVED: To avoid causing the ridging, polishing a dissimilar layer to be polished, using a different abrasive, without changing a polishing surface table and improve the working efficiency. SOLUTION: For feeding abrasives to this wafer polisher, it has a system for feeding an abrasive A suited to polishing a metal layer of a wafer and a system for feeding an abrasive B suited for polishing a barrier metal layer. As the metal layer polishing ends, the feed of the abrasive A is switched to the feed of the abrasive B to polish the barrier metal layer of the wafer, using the same polishing surface table 5.