RESIN-SEALED SEMICONDUCTOR DEVICE AND PRODUCTION THEREOF

摘要

PROBLEM TO BE SOLVED: To reduce electric degradation caused by cracking of a bonding part. SOLUTION: This resin-sealed semiconductor device has rewiring 3 of Cu connected to an electrode pad 2 of a semiconductor device 1, the surface of Cu post 4 connected to this rewiring 3 and an anisotropic conductive resin 5 sealed are flush with each other as the Cu post 4, the device is approximates the size into semiconductor device fractionized by processing in a wafer state of arranged plural semiconductor devices 1, and the anisotropic conductive resin 5 is sealed up to side surface of the semiconductor device 1.