WIRING BOARD, ITS MANUFACTURE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To surely enable connecting electrodes of a semiconductor element with external connection terminals, using wire bonding. SOLUTION: A wiring board 30 has a wiring pattern 16, where lands 24 to which external connection terminals 22 are bonded are formed on one end side, and wire bonding parts 16a to which bonding wires 40 are connected are formed on the other side, and is mounted on an electrode forming surface of a semiconductor element 10. In this case, the lands 24 are retained with a buffer layer 34 which relaxes thermal stresses which is generated when mounting is performed via the external connection terminals 22. The wire bonding parts 16a are retained by bonding retaining metal layers 36 formed at every wire bonding parts 16a.