| 摘要 |
PROBLEM TO BE SOLVED: To reliably detect the defect or the like of one type of or a plurality of types of patterns being formed on an object to be inspected. SOLUTION: A wafer 5 where patterns 23A and 23B with different pitches are formed is retained on a tilt stage 6. Nearly parallel illumination light is applied to the surface of the wafer 5 at an incident angle ofψby a lighting system consisting of a light source 1-a concave mirror 4, and diffraction light being generated at a reflection angle ofϕfrom the surface of the wafer 5 is received by a light reception system consisting of a concave mirror 12-an image pick-up element 15, thus obtaining the image data of the wafer 5. A tilt angle T of the tilt stage 6 is switched in a plurality of ways according to the pitch of the patterns 23A and 23B for obtaining each image data, and at the same time, the logic OR of the information of the defect or the like at each tilt angle is obtained.
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