发明名称 MATCH PLATE FOR ELECTRONIC COMPONENT TESTING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the operability and storing properties by dividing a frame member in two which is located between a plurality of sockets to be in contact with electronic components to be tested and a z-axis driving means to press the electronic components to be tested against the sockets and is operated together with the z-axis driving means. SOLUTION: An electronic component testing device is formed of a handler, a test head 5, a main device for tests, etc., and the handler is formed of a part housing ICs to be tested, a chamber part, etc. The chamber part is formed of a measuring part, etc., and the test head 5 is arranged at the center of the measuring part. The input/output terminals of ICs to be tested transferred above the test head 5 are electrically connected to the contact pins of the test head 5 to perform tests. IC sockets 50 are arranged above the test head 5. It is possible to transfer a test plate TST in between the upper part of the test head 5 and a pusher, and the IC sockets 50, and the match plate 60 is divided into match plates 60A and 60B by a division surface 64 along the x-axis.
申请公布号 JP2000206187(A) 申请公布日期 2000.07.28
申请号 JP19990008062 申请日期 1999.01.14
申请人 ADVANTEST CORP 发明人 YAMASHITA TAKESHI;ITO AKIHIKO
分类号 G01R31/26;(IPC1-7):G01R31/26 主分类号 G01R31/26
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