发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image pickup device capable of miniaturizing an image pickup unit and further narrowing and shortening the hardened tip part of an endoscope or the like. SOLUTION: The image pickup unit is constituted of an unpackaged solid- state image pickup chip 18 and a circuit board 20 connected to the back surface side where an electronic component 19 is mounted and a bonding pad 25 provided on the solid-state image pickup chip 18 and the bonding pad 27 provided on one surface of the circuit board 20 are electrically connected by a connection means 30 composed of a film where a wiring pattern is formed. The electronic component 19 is turned to a hidden state and mounted to a recess 28 formed on the end face of the circuit board 20, the surface of the circuit board 20 orthogonal to the surface provided with the connection means 30 is lower than the outer shape of the solid-state image pickup chip 18 and a level difference part 26 is formed. The level difference part 26 is provided with a terminal part 29 for connecting a signal cable 31 and the electronic component 19 mounted together with the circuit board 20 and the terminal part 29 of the signal cable 31 are settled within the projection area of the solid-state image pickup chip 18.
申请公布号 JP2000209472(A) 申请公布日期 2000.07.28
申请号 JP19990004567 申请日期 1999.01.11
申请人 SONY CORP 发明人 MIYASHITA TAKETO;KAJINAMI HITOSHI;SUZUKI YASUYUKI
分类号 H04N5/225;(IPC1-7):H04N5/225 主分类号 H04N5/225
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