| 摘要 |
PROBLEM TO BE SOLVED: To prevent warping with a printed circuit board under thermal load, etc., during transportation by providing a plurality of support fins whose length is larger than the height of an electronic part so as to protrude downward at a part except for electronic parts in the rear surface of the printed circuit board. SOLUTION: A plurality of support pins 4 whose length is larger than the maximum height of an electronic part 3 are provided so as to protrude downward at a part except for electronic parts in the rear surface of a printed circuit board 2. With this configuration, when a hybrid integrated circuit device 1 is placed on a plane D, support pins 4 contact the plane D before the electronic part 3 contacts it. So, the hybrid integrate circuit device 1 is surely supported to the plane D by points across the entire. Thus, the hybrid integrate circuit device 1 is transported while, for example, placed on the upper surface of a belt conveyor, reducing warping under thermal load during transportation.
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