| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for processing which enables throughput to be improved by reducing the transfer time of an object to be processed. SOLUTION: A first transfer chamber 122 and a second transfer chamber 133 of an apparatus for processing 100 have a volume capacity capable of containing only one wafer W, respectively, and are connected with each other through a first and second load lock chambers 130 and 132 including cooling plates and heating lamps. A first to fourth load boats 102, 114, 116, and 118, where cassettes 106 can be placed and a device 150 for positioning an object to be processed, are arranged around the first transfer chamber 122 of atmospheric pressure, and a first to fourth vacuum process chambers 158, 160, 162, and 164 are arranged around the second transfer chamber 133 of a reduced pressure. The first and second transfer chambers 122 and 133 is capable of holding two wafers W coping with each wafer, and are provided with a first and second transfer arms 124 and 156 which can transfer each wafer W independently. |
