| 摘要 |
PROBLEM TO BE SOLVED: To obtain reliability in bonding bare IC chips on a printed circuit board at mounting the IC chips on the printed circuit board via an anisotropic conductive bonding material. SOLUTION: Each IC chip 1 has, in a grid form, a plurality of electrodes 1B on an active plane 1Aa facing a printed circuit board 2. A semiconductor device 10 is mounted with the bare IC chips 1, which are arranged with a plurality of electrodes 1B in a grid form on the active plane 1Aa facing the printed circuit board 2. The bare IC chips are flip chip mounted via an anisotropic bonding material 3 on the printed circuit board 2A provided with electrodes 2B on the side of the printed circuit board, which correspond individually with a plurality of electrodes 1B in each bare IC chip.
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