发明名称 |
RESIN COMPOSITION, RESIN COMPOSITION LAYERED PRODUCT USING THE SAME, MANUFACTURE OF WIRING CIRCUIT AND MULTILAYER WIRING CIRCUIT, WIRING CIRCUIT AND THE MULTILAYER WIRING CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To provide a material for forming a wiring circuit without using a metal- laminated substrate and hazardous process by using a resin composition containing a conductivity expression material, in a base resin with conductivity changeable by a certain effect. SOLUTION: This resin composition has a microcapsule, having a wall material of polyurethaneurea and having a core material containing a conductive inorganic material, a base resin, a photopolymerizable unsaturated compound containing at least one ethylene unsaturated group and a photopolymerization initiator. On a support body 2b, the resin composition is laminated to form a resin composition layer 1a whose conductivity is raised thermal effect. At exposed part (a) attained by a laser- exposure in a pattern shape and a non-exposed part (b) unexposed at that time are exposed over the entire surface and then pressed; the exposed part (a) expresses conductivity to be a conductive part (c) and the non-exposed part (b) does not exhibit conductivity but remains as an insulative part (d). They are heated and hardened to fix the condition of having the conductive part (c) and the insulative part (d), so that change with time passage is suppressed and an interconnection circuit is obtained. |
申请公布号 |
JP2000207936(A) |
申请公布日期 |
2000.07.28 |
申请号 |
JP19990011707 |
申请日期 |
1999.01.20 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
OBATA RITSUKO;OTA FUMIHIKO |
分类号 |
H05K1/03;H01B1/20;H05K1/09;H05K3/10;H05K3/46;(IPC1-7):H01B1/20 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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