| 摘要 |
PROBLEM TO BE SOLVED: To enable the defect of a complex pattern to be easily seen in a defect-inspecting device for semiconductor for comparing and inspecting a chip on a wafer. SOLUTION: When two targets with the same shape are to be compared, the shading of an image being taken in is inverted. Concretely speaking, one and the other of two chips C and D with the same structure (or different wafers being manufactured by the same mask) are recognized as a negative image E and a positive image F, respectively, and are overlapped to obtain an image G, thus enabling only a flat image to be seen since images are canceled each other in the case of no defects and enabling only a defective part 13 to be seen since the images are not canceled each other if a defect 12 exists.
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