| 摘要 |
PROBLEM TO BE SOLVED: To enable an inspection device to apply a pressure uniformly to each terminal of an object to be inspected, without deteriorating the operability even when the number of terminals of a semiconductor device is comparatively increased. SOLUTION: This inspection device is equipped with an operation frame member 12 having an inclined plane parts (12F) and (12E), and a spring case 16 which has roller 16Da and 16Db engaging with the inclined plane parts (12F) and (12E) and accommodates a coil spring (40). In accordance with operation of the operation frame member 12, the spring case 16 is moved downward. Thereby, the coil spring (40) is deflected, and a semiconductor device (38) is pressed by the elastic force of the coil spring (40).
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