| 摘要 |
PROBLEM TO BE SOLVED: To increase the strength of stacked packages to prevent the packages from being cracked due to bending load by connecting the predetermined electrode of a sealed semiconductor package with the upper and lower packages by means of conductors, after connecting the wiring layer of an interposer with the electrodes of a thin silicon chip. SOLUTION: Packages of the same are stacked reversely, which enables a silicon chip 13 and interposer of each stage to be related as object and mirror image. The packages are stacked back on back and aligned on a mounting board 16. Thus, the hole of a connecting land 15 of each stage passes through a mounting wiring layer 17 on the mounting board 16. The through hole is then filled with a conductive adhesive 15a, and it is cured, which enables the connecting land 15 of each package, to be electrically connected with the wiring layer 17. A semiconductor device is constructed so that the addresses of the thin silicon chip 13 are selected, depending on where or not a supply voltage is supplied to some pins in order to stack the packages, which allows each stacked thin silicon chip 13 to operate independently. |
