| 摘要 |
PROBLEM TO BE SOLVED: To add a bar code to a semiconductor wafer without the concern for contamination. SOLUTION: A bar code pattern 3 constituted of an electrode part 4 and a substrate part, on which any electrode is not formed is formed through resist pattern etching, or two-dimensional bar code patterns 6 and 8 are formed through a mask evaporation or photolithographic method on one part of the surface of a semiconductor wafer 1 at the same time as that of the formation of electrodes. The bar code pattern 3 is constituted of the electrode part 4 and the substrate part, on which an electrode is not formed, so that the bar code pattern 3 can be formed at the time of the formation of electrodes. Thus, bar codes can be directly introduced to the semiconductor wafer by avoiding the problem of the contamination of the semiconductor wafer.
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